SUMCO EUROPE SALES PLC

The top companies supplying to UK government with the same SIC code (46760 - Wholesale of other intermediate products) as SUMCO EUROPE SALES PLC are:

• The council hasnt published the data
• We havent found or been able to process the councils data
• The company is part of a group of companies and another company in the group is liable for business rates
• The registered office may be a residential address which does not have a commercial designation. If the business is run from home then it won't be a commercial property and hence won't be liable for business rates.
• Serviced offices are increasingly popular and therefore a business may not be paying business rates directly - the building owner is and this is incorporated in the office rental charge.

Origin	Destination	Date	Import Code	Imported Goods classification description
		2018-12-00	38180090	Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
		2018-12-00	38180090	Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
		2018-11-00	38180090	Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
		2018-11-00	38180090	Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
		2018-10-00	38180090	Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
		2018-10-00	38180090	Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
		2018-09-00	38180090	Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
		2018-09-00	38180090	Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
		2018-08-00	38180090	Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
		2018-08-00	38180090	Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
		2018-07-00	38180090	Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
		2018-07-00	38180090	Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
		2018-06-00	38180090	Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
		2018-06-00	38180090	Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
		2018-05-00	38180090	Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
		2018-05-00	38180090	Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
		2018-04-00	38180090	Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
		2018-04-00	38180090	Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
		2018-03-00	38180090	Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
		2018-03-00	38180090	Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
		2018-02-00	38180090	Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
		2018-02-00	38180090	Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
		2018-01-00	38180090	Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
		2018-01-00	38180090	Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
		2016-05-00	38180090	Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
		2016-04-00	38180010	Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
		2016-03-00	38180010	Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
		2016-02-00	38180010	Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
		2016-01-00	38180010	Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
		2015-12-00	38180010	Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
		2015-11-00	38180010	Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
		2015-10-00	38180010	Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
		2015-09-00	38180010	Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
		2015-08-00	38180010	Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
		2015-07-01	38180010	Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
		2015-07-00	38180010	Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
		2015-06-01	38180010	Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
		2015-06-00	38180010	Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
		2015-05-01	38180010	Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
		2015-05-00	38180010	Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
		2015-04-01	38180010	Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
		2015-04-00	38180010	Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
		2015-03-01	38180010	Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
		2015-03-00	38180010	Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
		2015-02-01	38180010	Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
		2015-02-00	38180010	Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
		2015-01-01	38180010	Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
		2015-01-00	38180010	Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
		2014-12-01	38180010	Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
		2014-11-01	38180010	Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
		2014-10-01	38180010	Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
		2014-09-01	38180010	Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
		2014-08-01	38180010	Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
		2014-06-01	38180010	Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
		2014-04-01	38180010	Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
		2014-03-01	38180010	Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
		2014-02-01	38180010	Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
		2014-01-01	38180010	Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
		2013-12-01	38180010	Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
		2013-11-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2013-10-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2013-09-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2013-08-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2013-07-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2013-06-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2013-05-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2013-04-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2013-03-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2013-02-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2013-01-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2012-12-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2012-11-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2012-10-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2012-09-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2012-08-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2012-07-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2012-06-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2012-05-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2012-04-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2012-03-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2012-02-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2012-01-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2011-12-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2011-11-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2011-10-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2011-09-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2011-08-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2011-07-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2011-06-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2011-05-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2011-04-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2011-03-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2011-02-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2011-01-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2010-12-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2010-11-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2010-10-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2010-09-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2010-08-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2010-07-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2010-06-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2010-05-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2010-04-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2010-03-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2010-02-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)
		2010-01-01	85423290	Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash E²PROMs)

For goods imported into the United Kingdom, only imports originating from outside the EU are shown

• ACCOUNTING TECHNICIAN (PUBLICATIONS) LIMITED
• ACCOUNTING TECHNICIANS (SERVICES) LTD
• ADTHENA LTD
• AIDED ENGINEERING LTD
• ALIZOY UK LIMITED
• ALPHA CHAINS LTD
• ALPHA NURSERIES & CHILDCARE LIMITED
• OMNIO SERCLE LTD
• ASAFO MULTIMEDIA LTD
• BEYOND LAVISH LTD
• BRENTPILLAI LIMITED
• CLARKE & LLOYDS PROPERTY CONSULTANTS LTD
• BLOOM BUSINESS SOLUTIONS LTD
• LIGHTHAUS D+M LTD
• EDGE COMMERCIAL LIMITED
• FLAMBARD WILLIAMS LTD
• FX MASTER LIMITED
• GENECUBE LTD
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